An electronic heat sink is a device used to dissipate heat generated by electronic components such as transistors, integrated circuits, and power semiconductors. It is designed to absorb and transfer heat away from the component to the surrounding environment.Heat sinks come in various shapes, sizes, and materials, depending on the application and the amount of heat to be dissipated. The most common materials used for heat sinks are aluminum alloy and copper, which are good conductors of heat and easy to manufacture. Other materials such as graphite, ceramic, and diamond are also used for specialized applications.Electronic heat sinks work on the principle of conduction, where heat is transferred from the electronic component to the Aluminum Heat Sink through direct contact. The heat is then dissipated into the surrounding air or a liquid coolant, such as water or oil, through convection. Some heat sinks also use radiation to dissipate heat.The effectiveness of a heat sink depends on several factors such as the thermal conductivity of the material, the surface area, the airflow, and the temperature difference between the component and the environment. Electronic heat sinks are often used in conjunction with fans or other cooling devices to improve their performance. Electronic Heat Sink,Solder Heatsink,Electronic Radiator,Transistor Heat Sink Calculator Suzhou Remgar Metal Manufacturer Co.,Ltd. , https://www.rmheatsink.com
Standard of design and manufacture:GB/T12232 DIN f4 Â BS5163Â AWWA C509
Flange connection standard:GB/T17241.6Â BS EN1092-2Â ASME B16.1
Structural length standard:GB/T12221Â BS EN558-1 ASME B16.1
Test standard:GB/13927Â BS EN12266-1Â API598
technical parameter
inside nominal diameter : DN50 ~ DN300
Nominal pressure : PN16
working temperature : -5ºC--85ºC
Pressure Testing :
-Shell : PN*1.5
-Seal : PN*1.1
Applicable medium : water
Part Descripition
1- Body/Bonnet: GGG40/50
2- Stem: SS420/431
3- Bolts/Nuts: SS304
4- Wedge: GGG40/50 + EPDM Coating
5- Epoxy Resin coating internal & external, thickness above 300 micron
6- Flange or Socket Or Groove Ended
7- Work pressure: PN10/16; Size range: 1", 1 1/2", 2" to 24"
8- Design Standard: DIN F4/F5, BS5163, AS2638.2, AWWA C509/515
9- Operate: Handwheel
 Dimensions(mm)
Model
Size
DN
L
D1
D2
D3
H
H1
n-Φd PN16
NRS-0050
2''
50
178
99
125
165
285
335
4-Φ19
NRS-0065
2 1/2''
65
190
118
145
185
330
395
4-Φ19
NRS-0080
3''
80
203
132
160
200
400
480
8-Φ19
NRS-0100
4''
100
229
156
180
220
440
540
8-Φ19
NRS-0125
5"
125
254
184
210
250
565
690
8-Φ19
NRS-0150
6"
150
267
211
240
285
595
745
8-Φ23
NRS-0200
8"
200
292
266
295
340
715
915
12-Φ23
NRS-0250
10"
250
330
319
355
405
850
1100
12-Φ28
NRS-0300
12"
300
356
370
410
460
990
1290
12-Φ28
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In conclusion, electronic heat sinks are essential components in electronic devices that generate heat. They play a crucial role in ensuring the reliable operation and longevity of electronic components.
Hot Sale Rising Stem Water Seal Resilient Wedge Gate Valve
Usage: Flow Control
Standard: DIN
Application: Industrial Usage, Water Industrial Usage
Pressure Rate: Pn10/16/25
Stem: SS304/420/316
Operator: Cap Nut/Handwheel
Size Range: Dn50-600
Coating: Epoxy Coated 250 Microns
Nuts: Brass
Trademark: Walter
Transport Package: Bubble Bags & Wooden Case
Origin: Suzhou, Jiangsu
HS Code: 8481801090
Hot Sale rising stem water seal resilient wedge gate valve
Product standard